In a significant step towards creating semiconductor manufacturing ecosystem in IndiavTata Electronics on Saturday began the construction of its Rs 27,000-crore chip assembly plant in Assam, which is expected to become operational next year.
The function for commencement of construction of Tata’s semiconductor unit in Assam was held August 3, 2024 in the presence of Assam Chief Minister Himanta Biswa Sarma and Chairman of Tata Sons Limited N Chandrasekaran.
Chairman of Tata sons N Chandrasekaran announced that the plant is expected to create 27,000 jobs, including 15,000 direct and 12,000 indirect employment opportunities. “We want to move fast.
Chandrasekaran also said “we hope in 2025 we will be able to complete this facility and quickly start operations,”
Compliments also to our people for their spirited faith in our Government that keeps driving us to chase dreams, set new benchmark and constantly strive for the better.
Union Minister for Railways, Electronics & Information Technology and Information and Broadcasting, Ashwini Vaishnav, during his interaction with the media, stated that the Prime Minister of India has always emphasised on Act East policy and a very important milestone is being achieved today in Assam with the commencement of construction of this facility. He mentioned that this project was approved by the Union Cabinet on 29th February, 2024.
The programme for development of Semiconductors and Display Manufacturing Ecosystem in India was with a total outlay of ₹ 76,000 crore. In June, 2023, the Union Cabinet led by Prime Minister of India, Narendra Modi had approved the proposal of Micron for setting up a semiconductor unit in Sanand, Gujarat whose construction is progressing at a rapid pace.
About the semiconductor unit
The Union Minister mentioned that this unit will be set up with an investment of ₹ 27 thousand crores and is expected to generate 15 thousand direct and 11-13 thousand indirect jobs. While highlighting the importance of the Semiconductor industry as being a foundational one, he said that employment opportunities in various upstream and downstream industries will be created.
The proposed capacity of this unit is 4.83 crore semiconductor chips per day. He also pointed out that this unit will be the site for development of indigenous advanced semiconductor packaging technologies including Wire Bond, flip chip and I-SIP (integrated system in package) technologies and all these three major technologies which will be deployed in this plant are being developed in India. These technologies are extremely critical for key applications such as automotive (especially electric vehicles), communications, network infrastructure and others
Talent development plan
The Union Minister also mentioned that 85,000 industry-ready workforce at B.Tech, M.Tech and PhD level in semiconductor chip design are being trained at 113 academic institutions across the country including NIT Silchar in Assam, NIT Mizoram, NIT Manipur, NIT Nagaland, NIT Tripura, NIT Agartala, NIT Sikkim, NIT Arunachal Pradesh and two institutes in Maghelaya North Eastern Hill University and NIT are involved in talent development for semiconductor industry.
This project was approved by the Union Cabinet on 29th February, 2024.
Photo Credit: X
